Researchers from Skoltech have made a significant breakthrough in improving the properties of a commonly used polymer in 3D printing. By incorporating boron nitride “flakes” into the photopolymer, the team successfully doubled its thermal conductivity. This advancement holds promise for preventing overheating in microchips and enabling the development of smaller, more powerful microelectronic devices.
The relentless pursuit of smaller electronic devices exacerbates the issue of overheating. The same power packed into a smaller volume leads to faster overheating and eventual device failure. To overcome this challenge, materials with improved thermal conductivity are essential.
Conventionally, radiation-cured photopolymers similar to those used in 3D printing, serve as the external packaging for microchips, particularly those with intricate shapes. However, its low thermal conductivity obstructs effective heat dissipation. The Skoltech study sought to enhance the photopolymer’s properties for microchip packaging, focusing on improving thermal conductivity while upholding insulation and mechanical strength.
To achieve their goal of creating a smaller electronic device while retaining thermal conductivity, the researchers incorporated boron nitride flakes into the photopolymer, comprising 20% of its volume. Boron nitride is known for its excellent thermal conductivity and non-conductive nature, making it an ideal candidate for enhancing the polymer’s properties. Remarkably, this modification doubled the thermal conductivity without compromising insulation or mechanical integrity.
This breakthrough holds the potential to mitigate the issue of overheating in microelectronic devices, paving the way for smaller and more powerful technologies. By merging microelectronics and additive manufacturing, this innovation marks a crucial step towards a future of efficient and reliable electronic devices.
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