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EOS Introduce EOS CopperAlloy CuNi30 for LPBF 3D Printing

February 19, 2024

EOS has unveiled EOS CopperAlloy CuNi30, a copper-nickel alloy tailored for laser powder bed fusion 3D printing. Boasting impressive mechanical properties, including a UTS of 510 MPa and over 20% elongation, it meets stringent UNS C96400 specifications outlined in ASTM B369-09.

Developed in collaboration with Phillips Federal and Austal USA for the submarine industrial base (SIB), this material addresses supply challenges in traditional castings, aligning with the U.S. Navy’s objectives for the 2+1 Columbia and Virginia Class submarine platforms. Notably, its performance-to-cost ratio makes it a compelling choice for production adoption.

EOS Introduce EOS CopperAlloy CuNi30 for LPBF 3D Printing
Some sort of bracket printed in the new CuNi30 alloy. (Image Credit: EOS)

“EOS was provided with a strategic objective to deliver a CuNi30 product to the U.S. Navy submarine industrial base to mitigate casting delays; a material holding unique to the naval construction industry and not widely available for AM technology use,” said Ankit Saharan, senior manager of metals technology at EOS.

“We acted with priority to support the submarine program schedule, and we are pleased to share our successful product release within a few months of the project start. It is a privilege to contribute to projects of such strategic importance to our national interests.”

The introduction of EOS CopperAlloy CuNi30 promises to revolutionize CuNi alloy manufacturing, traditionally reliant on costly casting processes. With EOS’s additive manufacturing technology, manufacturers can now achieve supply chain efficiencies, accelerated lead times, and reduced inventories. This development not only meets stringent application requirements but also unlocks new design possibilities, empowering manufacturers with regional, local, and on-demand production capabilities.

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About the author | Phillip Keane
Phillip is an aerospace engineer from UK. He is a graduate of Coventry University (UK), International Space University (France) and Nanyang Technological University (Singapore), where he studied Advanced Manufacturing at the Singapore Centre for 3D Printing.
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