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Firestorm Labs Secures $12.5M Funding Led by Lockheed Martin Ventures

March 25, 2024

Firestorm Labs, a California-based Unmanned Aerial System (UAS) manufacturer, has secured $12.5M in seed investment, led by Lockheed Martin Ventures and other notable defense investors. This investment aims to advance Firestorm’s pioneering efforts in expeditionary additive manufacturing for UAS applications.

Firestorm Labs Secures $12.5M Funding Led by Lockheed Martin Ventures
Shipping container featuring 3D printers for manufacturing in the field. (Image Credit: Firestorm Labs)

The company’s xCell line offers high production capacity within compact container form factors, facilitating deployment to remote locations or covert operations. Key investors, including Lockheed Martin Ventures, recognize the critical importance of rapidly delivering technology solutions with enhanced interoperability to meet the demands of modern warfighters.

“Firestorm is excited to announce this latest round of funding that will propel the company forward to shape the rapidly evolving needs of a UAS-dominated battlefield and a defense industrial base ripe for revolutionary manufacturing models,” said CEO Dan Magy. .

“Our investors understand the pressing need for delivering technologies quickly and with the interoperability that today’s warfighters demand, and we are thrilled to welcome Lockheed Martin Ventures partnership in this mission.”

Already securing contracts with the U.S. Department of Defense, Firestorm plans to utilize the new funding to expand its team and production capacity to meet growing market demands. As the company continues to innovate in modular UAS technology, it positions itself as a key player in supporting the evolving needs of today’s warfighters.

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About the author | Phillip Keane
Phillip is an aerospace engineer from UK. He is a graduate of Coventry University (UK), International Space University (France) and Nanyang Technological University (Singapore), where he studied Advanced Manufacturing at the Singapore Centre for 3D Printing.
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