A collaborative effort between NIMS, Sumitomo Metal Mining Co., Ltd., N.E. CHEMCAT CORPORATION, and Priways Co., Ltd. has yielded a new thick-film conductive ink designed for printed electronics.
Exhibited at the 38th Nepcon Japan exhibition, this ink offers enhanced capabilities for printing electronic circuits and sensors onto various substrates, including flexible ones.
Printed electronics, present environmental and cost advantages. By directly printing circuits onto substrates, less metallic material is used, and the process is adaptable to both rigid and flexible surfaces, promising efficient wiring solutions for next-generation devices.
The novel conductive ink, formulated from metal complex inks and metallic powder synthesis technologies, boasts controllable thickness and compatibility with low-temperature sintering. Its incorporation of copper particles enables the formation of thick-film wiring at approximately 200°C on heat-resistant plastic films.
In addition to its cost-effectiveness and oxidation resistance, this ink supports thicker film deposition, catering to the needs of large-area, high-current electronic products.
Ongoing efforts focus on mass production techniques, with plans to further enhance performance and explore new applications.
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