Demcon, a technology development company, has acquired Bond3D, a Dutch 3D printing technology firm specializing in high-performance polymer printing. Bond3D, founded in 2014, will maintain its operations at the Demcon Technology Center in Enschede, where it has been located for the past four years.
The acquisition brings together Bond3D’s expertise in printing leak-proof products with Demcon’s extensive R&D capabilities and engineering resources. Bond3D has developed a unique technology that enables the production of 100% leak-tight components while maintaining high strength in all directions, setting it apart from traditional additive manufacturing methods.
The company’s primary focus has been on printing with PEEK (PolyEtherEtherKeton), a high-performance polymer known for its mechanical strength, chemical resistance, temperature stability, and biocompatibility. Current applications include medical implants, semiconductor industry components, and small-series products for the clean energy sector.
Dennis Schipper, Demcon CEO, describes the acquisition as a strategic move: “We can strengthen each other mutually. To begin with, we provide Bond3D with more financial capabilities. This allows them, with the support of our R&D people and engineers, to take their 3D printing technology to an even higher level and develop new promising PEEK products.”
Demcon, which employs over 1,100 people across locations in Best, Delft, Enschede, Groningen, Leiden, Maastricht, Münster, Tokyo, and Singapore, adds Bond3D’s polymer printing capabilities to its existing portfolio of metal and glass printing technologies. The merger aims to expand the application of high-performance 3D-printed polymer products across various industrial sectors.
Source: linkmagazine.nl